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Lithography

  Lithography
Lithography is a photographic method to define the lateral device structures, by exposing a thin polymer (i.e., photoresist) through a mask or by using a focused beam or a stamp. The line width is defined by the exposure tool.
 
A line width of 1 µm is routinely obtained by mask aligners, and i-line and g-line steppers offer linewidths of down to 0.5 µm and an alignment accuracy of 90 nm. Nanoimprint lithography reach linewidths of down to 60 nm, while the more complex process of Sidewall transfer lithography produce linewidths in the 10 - 100 nm range reproducibly.
 
Here we present the exposure tools together with the necessary additional tools, e.g., resist spinners and developers, hot plates and bake ovens.
 
Click on heading to sort the table.
 
 NameManufacturerModel
DetailsGammaSuss MicrotecGamma 4M
DetailsBake 7MemmertUM 100 bake
DetailsFH APL-gulPM PlastDragskåp
DetailsKarl SussKarl SussMask aligner MA8/BA8
DetailsSabinaSSESpinner model Primus SB15
DetailsXLS-StepperGCA/Ultratech7500/2145 i-line stepper
DetailsDSW-StepperGCA/Ultratech8500/2035 g-line stepper
DetailsEmmaKarl SussMA6/BA6
DetailsNilsEVG620 UV Nanoimprint Lithography
DetailsBake 2Bake oven DespatchPre and postprocessing of samples
DetailsBake 3Bake oven MemmertPre and postprocessing of samples
DetailsMasktvättUltra t Equipment Company, Inc.SCS 124
DetailsArnoldSSE spincoaterOPTISPIN SST20
DetailsAPL-HMDSYES-5E Vacuum Bake / Vapour Prime Processing System
DetailsHMDS 2IMTECStar 2000 (HMDS)
DetailsFH Gul3PM PlastDragskåp
DetailsALS-stepperGCA/UltratechALS 2035 G-line
DetailsBake 4MemmertU 26
DetailsBake 6MemmertULM 400
DetailsMaximusSSEMaximus 804
DetailsManual spray coaterHome madev1
DetailsFH Gul1clanLAFVFR 1206 LAF
DetailsAPL spinnerBLEBuilt in
DetailsEbeam litho AlbanovaRaith GmbHRaith 150 TK
DetailsKarl Suss MJB3 AlbanovaKarl SussMJB3
DetailsAlbanova Canon Projection CameraCanonPPC 210