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Myfab

Realize your nano vision

All tools

Resources at your disposal

The Electrum Laboratory maintains a multitude of laboratories, covering most aspects of nano and microtechnology. In our flexible facilities both single samples and batches are equally welcome. We handle separate steps to full sequences in fabrication and characterization. We offer access to sophisticated software for calculation and simulation. Our personnel are available to help you to master the wide world of nano and microtechnology.

Full process lines and characterization resources

In our cleanroom we maintain full process lines for Silicon CMOS, MEMS and compound semiconductors, including GaAs, InP and SiC. We also offer access to a wide variety of techniques for characterization of materials and devices.

(Click on the headers to change order)

 NameManufacturerModelCategoryArea nameCurrent toolratetype name
DetailsPamelaSTS 308PC (RF Plasma Asher)Dry etchingC-AnnealB
DetailsTencor P15TencorSurface profiler Tencor-P15MetrologyC-AnnealB
DetailsRTAMattson100 RTP SystemsThermal processesC-AnnealD
DetailsALDBENEQTFS200Thin film depositionC-AnnealC
DetailsUVISELHORIBAUVISEL ERMetrologyC-AnnealB
DetailsBalanceBalanceVågOther processesC-Si-epiA
DetailsEpsilon2000ASM200Si-epiEpitaxyC-Si-epiE
DetailsDSW-StepperGCA/Ultratech8500/2035 g-line stepperLithographyC-Gul 3E
DetailsM11 Nikon/CD 1NikonOPTISHOT/LinjebreddsmätareMetrologyC-Gul 1A
DetailsBake 2Bake oven DespatchPre and postprocessing of samplesLithographyC-Gul 1A
DetailsBake 3Bake oven MemmertPre and postprocessing of samplesLithographyC-Gul 1A
DetailsM10 Nikon/autoNikonMicroscope (motorized objectives)Surface analysis & TEMC-Gul 1A
DetailsNSRNikonTFHi12LithographyC-Gul 1E
DetailsEnduraApplied MaterialsPVDThin film depositionC-Si-metalD
DetailsP5000Applied MaterialsPrecision 5000 Mark II (Dielectric, MxP, CVD)Dry etchingC-Si-metalD
DetailsAsterixAixtron AIX 200/4MovpeEpitaxyC-Epi-III/VE
DetailsQuicksealQuicksealInplastningOther processesC-APLA
DetailsIDPExpertechLPCVD furnaceThin film depositionC-APLC
DetailsCenturaApplied MaterialsCentura II (DPS & MxP)Dry etchingC-APL-CenturaD
DetailsALS-stepperGCA/UltratechALS 2035 G-lineLithographyC-APL-CenturaE
DetailsProbestation 3 Semi AutomaticCascade MicrotechCascade 12000MetrologyY-Electrical characterizationA
DetailsNetwork AnalyzerAgilentPNA 110 GHzMetrologyY-Electrical characterizationA
DetailsProbestation 1 ManualCascade11000MetrologyY-Electrical characterizationA
DetailsProbestation 2 High VoltageCascade8-inch manualMetrologyY-Electrical characterizationA
DetailsProbestation 4 High Temp.SignatoneS-1060MetrologyY-Electrical characterizationA
DetailsAFM/SSRMVeeco/Digital InstrumentsNanoScope Dimension 3100MetrologyY-Hall rumB
DetailsHR X-RayX-RayX-RayMetrologyY-HR X-rayB
DetailsBlästerGuyson Europlast4 SF-Select (med inställbar hjöd) samt utsugningsfOther processesY-yttrelabA
DetailsWetb SiCWet bench Substrate cleaningWet process benchesC-APLA
DetailsRörtvättKTHhandmadeOther processesY-yttrelabA
DetailsGammaSuss MicrotecGamma 4MLithographyC-APL-CenturaC
DetailsFTP500FTPInterferometerMetrologyC-APLA
DetailsSSECVeccoSSEC 3300Wet process benchesC-RIBEA
DetailsT1-Oxide 1150CThermco5200Thermal processesC-APLB
DetailsT2-Oxide 1250CThermco5200Thermal processesC-APLB
DetailsT3-Gate oxThermco5200Thermal processesC-APLB
DetailsT4-FGAThermco5200Thermal processesC-APLB
DetailsWetb Si stripWet bench developerPhotoresist processing.Wet process benchesC-Gul 1A
DetailsWetb APL-gulWet benchWet benchWet process benchesC-APL-gulA
DetailsLäcksökarenPfeiferQualyTest HLT260Other processesC-SlussA
DetailsMS02 NikonNikonStereo microscope SMZ-2TSurface analysis & TEMC-STS-labA
DetailsM13 Nikon/cameraNikonNikonSurface analysis & TEMC-STS-labA
DetailsM14 Olympus/cameraOlympusBX60Surface analysis & TEMC-Si-metalA
DetailsMasktvättUltra t Equipment Company, Inc.SCS 124LithographyC-Gul 1A
DetailsWetb Au developWet benchWet benchWet process benchesC-Gul 1A
DetailsR/D Gul1FSI PhoenixFSI Phoenix 4"Wet process benchesC-Gul 1A
DetailsR/D 2VerteqVerteq 4"Wet process benchesC-Si-epiA
DetailsWetb-diff-cleanWet bench CleanWet bench Clean and IMECWet process benchesC-Si-epiA
DetailsW0607Wet bench HF cleanWet bench HF clean and HF dopedWet process benchesC-Si-epiA
DetailsR/D doubleSemitoolSemitool Double 870SWet process benchesC-Wet ChemistryA
DetailsWetb MEMSWet benchTMAH, HF, KOHWet process benchesC-Wet ChemistryA
DetailsWetb metalWet benchAu/metal etchWet process benchesC-Wet ChemistryA
DetailsWetb solventWet benchRemover, Vax, Au moduleWet process benchesC-Wet ChemistryA
DetailsWetb Si processWet bench oxideWet bench oxide,HF 1:10,BHF,HFmixWet process benchesC-Wet ChemistryA
DetailsRenrumElabAccessOther processesVirtualA
DetailsTesttoolTest AB eller OYStandardOther processesVirtualA
DetailsLab supportELABVirtual toolOther processesVirtualA
DetailsCleanroomElectrumElectrum LaboratoryOther processesVirtualA
DetailsFH epi servicePM PlastDragskåp för epi rengöringWet process benchesC-Wet ChemistryA
DetailsFH wet chemistry-7PM PLastDragskåpWet process benchesC-Wet ChemistryA
DetailsFH wet chemistry-8PM PlastDragskåpWet process benchesC-Wet ChemistryA
DetailsFH wet chemistry-2 (solvent)PM PlastDragskåp solventWet process benchesC-Wet ChemistryA
DetailsFH wet chemistry-3PM PlastDragskåp solvent and acidWet process benchesC-Wet ChemistryA
DetailsFH wet chemistry-4PM PlastDragskåp solventWet process benchesC-Wet ChemistryA
DetailsFH wet chemistry-5 (solvent)PM PlastDragskåp solventWet process benchesC-Wet ChemistryA
DetailsFH wet chemistry-6PM PlastDragskåp solventWet process benchesC-Wet ChemistryA
DetailsFH wet chemistry-1 (service)PM PlastDragskåp solvent & acid (for service work)Wet process benchesC-Wet ChemistryA
DetailsR/D MetalsSemitoolSemitool 4" MetalsWet process benchesC-Wet ChemistryA
DetailsR/D GoldFSI PhoenixFSI Phoenix 4" Au/Lift-OffWet process benchesC-Wet ChemistryA
DetailsM08 Leitz/cameraLeitzMicroscope with cameraSurface analysis & TEMC-Wet ChemistryA
DetailsM09 Nikon/cameraNikonMicrosocpe with cameraSurface analysis & TEMC-Wet ChemistryA
DetailsMS01 NikonNikonStereo microscope SMZ-2BSurface analysis & TEMC-Wet ChemistryA
DetailsALOESSTSICP AOE (DRIE)Dry etchingC-STS-labD
DetailsSTSSTSPECVDThin film depositionC-STS-labD
DetailsCritical Point DryerBaltecCPD 408Other processesC-APL-SiCC
DetailsBond Tester DAGEDAGE2400PCMetrologyY-Pack labA
DetailsManual spray coaterHome madev1LithographyC-Gul 1A
DetailsMegasonic bathPCTPCT 24 wet benchWet process benchesC-Wet ChemistryA
DetailsOptical profilometerVeecoWyko NT9300MetrologyC-AnnealB
DetailsCanon EOS 350DCanonEOS 350D 100mm MacroSurface analysis & TEMC-AnnealA
DetailsDisco DAD sawDiscoDAD 320SawingY-Hall rumB
DetailsuFABMSTMST labOther processesY-MSTB
DetailsTheta LiteMSTMST labSurface analysis & TEMY-MSTB
DetailsSpeed mixerMSTMST labOther processesY-MSTB
DetailsNikon Microphot-FXANikonMicrophot-FXAOther processesY-MSTB
DetailsMicrowave/THz Probe StationMSTMST LabMetrologyY-MSTB
DetailsZVA-24 Vector Network AnalyzerMSTMST LabMetrologyY-MSTD
DetailsCNC-milling machineMinitechMini-MillOther processesY-MSTB
DetailsTencor P10TencorSurface profiler Tencor-P10MetrologyY-Synth labsA
DetailsRakelDage Precima InternationalRakelDevice mountingY-yttrelabB
DetailsBall bonderF&K Delvotec Semiconductor GmbH5410Device mountingY-yttrelabB
DetailsOrthodyneOrthodyne20 Large WirebonderDevice mountingN-MeasurementB
DetailsPrometeus autoKarl Suss and Temptronic TermoChuck SystemAutomatic Probestation PA 150 and TP03215B-3300-2MetrologyN-MeasurementC
DetailsAFM AcreoDigital Instruments (Veeco)Atomic Force MicroscopeMetrologyN-MeasurementC
DetailsPrometeus manualKarl Suss and Temptronic TermoChuck SystemManual Probestation PM 5, TP0314AMetrologyN-MeasurementB
DetailsBertilWest Bond 7476E-79 Manual Wedge-Wedge Wire BonderDevice mountingN-MeasurementB
DetailsElectroglasElectroglas2001XMetrologyN-MeasurementC
DetailsTLE labTanner15.10Other processesN-MeasurementA
DetailsCryogenic ProbestationJanisST-500-UHTMetrologyN-MeasurementC
DetailsFTIR SpectrometerBrukerVortex 70 VMetrologyN-MeasurementC
Details4-PointFour Dimensions, IncModel 280MetrologyC-AnnealA
DetailsActivatorCentrothermActivator 150 (SiC anneal)Thermal processesC-AnnealD
DetailsManual probstationSuss Microtech10500006 (probe station)MetrologyC-AnnealA
DetailsSkivthkMitutoyoRDP transducer indicator E307-1MetrologyC-Wet ChemistryA
DetailsRoomRElabresponsibleOther processesVirtualA
DetailsLEITZLEITZ MPV-SPThin film interferometry, MetrologyC-AnnealA
DetailsLIMSElabAccessOther processesVirtualA
DetailsKemvåg??MetrologyC-Wet ChemistryA
DetailsLäppusLogitech50 Precision Lapping & Polishing MachineOther processesC-Wet ChemistryB
DetailsEmmaKarl SussMA6/BA6LithographyC-Gul 3C
DetailsBonderKarl SussCB8 Substrate BonderDevice mountingC-Gul 1C
DetailsKarl SussKarl SussMask aligner MA8/BA8LithographyC-Gul 1C
DetailsFH Gul3PM PlastDragskåpLithographyC-Gul 3A
DetailsKyl & frysElectroluxKylskåp/frysOther processesC-Gul 3A
DetailsW34Wet benchWet bench LithografiWet process benchesC-Gul 3A
DetailsArnoldSSE spincoaterOPTISPIN SST20LithographyC-Gul 3B
DetailsSabinaSSESpinner model Primus SB15LithographyC-Gul 3B
DetailsYes-ugnYESPolyimide Bake Oven YES-450PB8-2/6-2Thermal processesC-Gul 3C
DetailsBake 4MemmertU 26LithographyC-Gul 3A
DetailsBake 5MemmertU 26Thermal processesC-Gul 3A
DetailsBake 6MemmertULM 400LithographyC-Gul 3A
DetailsM04 LeitzLeitzLABORLUX 12 HLSurface analysis & TEMC-Gul 3A
DetailsM05 Nikon/autoNikonMicroscopeSurface analysis & TEMC-Gul 3A
DetailsHMDS 2IMTECStar 2000 (HMDS)LithographyC-Gul 3A
DetailsWetb SabinaPM Plast2 HP, Developer, SinkWet process benchesC-Gul 3A
DetailsArielOxford Plasma TechnologyPlasmalab80Plus (Oxford RIE System)Dry etchingC-Q-EtchD
DetailsPekkaPlasmalab80Plus (Oxford PECVD System) Chamber AThin film depositionC-Q-EtchD
DetailsPeoPEOPEO-603 Anneal furnace III/V (ramp)Thermal processesC-Q-EtchB
DetailsEsaOxford Plasma SystemPlasmalab80Plus (Oxford RIE System) Chamber BDry etchingC-Q-EtchD
DetailsFabioOxford InstrumentICP380 Etch SystemDry etchingC-Q-EtchD
DetailsGallusOxford InstrumentICP380 Etch System (GaAs & InP)Dry etchingC-Q-EtchE
DetailsTeplaTePla300 (Microwave Plasma Asher)Dry etchingC-Q-EtchB
DetailsM07 Olympus/cameraOlympusMicroscopeSurface analysis & TEMC-Q-EtchA
DetailsR/D 3VerteqVerteqWet process benchesC-Q-EtchA
DetailsFH III/VPM PlastDragskåpWet process benchesC-Q-EtchA
DetailsW2631Wet benchWet bench spray etch (GaAs).Wet process benchesC-Q-EtchA
DetailsW3233Wet benchWet bench lift off.Wet process benchesC-Q-EtchA
DetailsMaximusSSEMaximus 804LithographyC-Gul 1C
DetailsRIEPlasmalab System 100RIE of thin films (Si3N4 & SiO2)Dry etchingC-Si-metalD
DetailsICPSTSICP DRIE (Si, SiO2)Dry etchingC-Si-metalD
DetailsIBSCommonwealth Scientific CorporationIon Beam Sputtering ToolThin film depositionC-Metal-III/VD
DetailsKDFKDF844GTThin film depositionC-Metal-III/VD
DetailsBarbaraProvacPAK 600 Coating SystemThin film depositionC-Metal-III/VD
DetailsIndiraBalzersBA 510 Thermal EvaporatorThin film depositionC-Metal-III/VD
DetailsEdvardEdvards160Thin film depositionC-Metal-III/VD
DetailsFilippaSussMicrotecAutomatic Flip Chip Bonder FC150Device mountingC-HybridiseringD
DetailsNiklasNikonNiklasMetrologyC-HybridiseringB
DetailsPlasmatvätt PicoDiener PICO RFLow pressure plasma etcherDry etchingC-HybridiseringB
DetailsFH MS OlympusLabrum klimatLAFDevice mountingC-HybridiseringA
DetailsFH MS NikonLabrum klimatLAFDevice mountingC-HybridiseringA
DetailsSSE SprayetsSSESprayetsWet process benchesC-HybridiseringA
DetailsSemlanEpigress VP508/SK SiC-VPEEpitaxyC-Epi-SiCE
DetailsNapoleonAixtronVP508GFR SiC epiEpitaxyC-Epi-SiCE
DetailsCD SEMHitachiS-3400N & EDS QUANTAX 200Surface analysis & TEMC-RIBEC
DetailsAPL-HMDSYES-5E Vacuum Bake / Vapour Prime Processing SystemLithographyC-APL-gulA
DetailsAPL spinnerBLEBuilt inLithographyC-APL-gulB
DetailsRinser 2VerteqVerteqWet process benchesC-APL-gulA
DetailsBake 7MemmertUM 100 bakeLithographyC-APL-gulA
DetailsFH APL-gulPM PlastDragskåpLithographyC-APL-gulA
DetailsM01 OlympusOlympusBX60MSurface analysis & TEMC-APL-gulA
DetailsFiber annealÅngpaneföreningenSpecial designOther processesC-APLA
DetailsM02 Olympus/cameraOlympusBX60Surface analysis & TEMC-APLA
DetailsM03 LeicaLeicaMicroscopeSurface analysis & TEMC-APLA
DetailsRinser 1VerteqVerteqWet process benchesC-APLA
DetailsUVO CleanerJelight COmpany, Inc42-220Sample prepC-APLA
DetailsDektakSTDektak3STMetrologyC-APLB
DetailsFH APLFume hoodFume hoodWet process benchesC-APLA
DetailsDisco-sawDiscoDFD640 SawingC-DISCO sawC
DetailsMozartVeeco TurboDiscGaAs-MOVPE D180 LDMEpitaxyC-Epi MozartE
DetailsFs Laser system 1CoherentMira 900Other processesY-Optics 3168A
DetailsFs Laser system 2Coherent and APEChameleon Ultra II + APE Harmonics generatorOther processesY-Optics 3168A
DetailsScanning near-field optical microscope (SNOM)Max Born Institute with modifications at KTHA home-made instrument Surface analysis & TEMY-Optics 3168A
DetailsHallVarian/KeithlyIn-houseMetrologyY-Hall rumB
DetailsObelixAixtronLP-VPE 2106EpitaxyC-Epi-III/VE
DetailsRIBEOxford Instruments Plasma TechnologyIonfab 300 plusDry etchingC-RIBED
DetailsZitaBalzersBAE 250 Coating SystemThin film depositionY-yttrelabD
DetailsNilsEVG620 UV Nanoimprint LithographyLithographyC-Gul 3C
DetailsUEMJEOL JEM-2100Ultrafast Electron MicroscopySurface analysis & TEMY-SEM labsE
DetailsVT STMOmicronOmicron VT-STMSurface analysis & TEMY-Mats-labA
DetailsSTM 1OmicronOmicron STM-1Surface analysis & TEMY-Mats-labA
DetailsUHV SPM 3500RHK TechnologyUHV SPM 3500Surface analysis & TEMY-Mats-labA
DetailsRaman Spectrometer HORIBA iHR 550HORIBA Jobin YvoniHR 550MetrologyY-Mats-labA
DetailsBaltazar spectrometerSPECS GmbH and homemadeHomemadeMetrologyY-BaltazarA
DetailsAGMPrinceton Measurement Corporation2900-02 Alternating Gradient MagnetometerMetrologyY-yttrelabC
Details3D MF ProbestationIn-houseMedium Field MR and RF Probe StationMetrologyY-yttrelabC
DetailsHF ProbestationIn-houseHigh Field RF Characterization StationMetrologyY-yttrelabC
DetailsCIPTSmartipCIPTechMetrologyY-yttrelabC
DetailsSQUID-VSMQuantum DesignUtlrasensitiv magnetometerMetrologyY-CryolabC
DetailsAJA SputterAJA InternationalATC Orion-8Thin film depositionY-Synth labsD
DetailsEmpyreanPANalytical B.V.Empyrean multipurpose high resolution X-ray diffraMetrologyY-XRD labC
DetailsPreparation labCollection of toolsTools for sample preparationSample prepY-SEM labsB
DetailsFE-TEMJEOLJEM 2100F(HR), JEOL Electron Microscope 2100 FieldSurface analysis & TEMY-SEM labsD
DetailsFIB-SEMFEIQUANTA 3D FEG Surface analysis & TEMY-SEM labsD
DetailsPlasma cleanerFischionePlasma cleanerSample prepY-SEM labsA
DetailsGold sputter FNMJEOLIon sputter JFC-1100Sample prepY-SEM labsA
DetailsDiamond sawBuehlerIsomet low speed sawSample prepY-SEM labsA
DetailsGrinder-polisherBuehlerVector/AlphaSample prepY-SEM labsA
DetailsUltrasonic disc cutterGatanModel 601Sample prepY-SEM labsA
DetailsDimple grinderGatanDimple grinderSample prepY-SEM labsA
DetailsElectrolyte polishingFischioneElectrolyte polishingSample prepY-SEM labsA
DetailsIon polishingGatanPrecision ion polishing 691Sample prepY-SEM labsA
DetailsM20 MicroscopeNanometricsMicroscopeSample prepY-SEM labsA
DetailsLaboratory ovenHereausBench ovenSample prepY-SEM labsA
DetailsGeminiZeiss Ultra 55Surface analysis & TEMY-SEM labsC
DetailsTesttool ELABElectrum labmodel 1MetrologyVirtualA
DetailsCryo RIE AlbanovaOxfordPlasmalab 100Dry etchingAlbanova C1:3052D
DetailsEdwards Auto 306 AlbanovaEdwardsAuto306 with FL400 chamberThin film depositionAlbanova C1:3052D
DetailsProfiler AlbanovaKLA-TencorP15MetrologyAlbanova C1:3052B
DetailsRIE ICP O2/AR AlbanovaOxfordPlasmalab 80+Dry etchingAlbanova C1:3052D
DetailsOpt. micr. 1, AlbanovaNikonME600Surface analysis & TEMAlbanova C1:3052A
DetailsOpt. micr. 2, AlbanovaNikonME600Surface analysis & TEMAlbanova C1:3052A
DetailsEbeam litho AlbanovaRaith GmbHRaith 150 TKLithographyAlbanova E1:1015AE
DetailsFIB/SEM AlbanovaFEI CompanyNova 200Surface analysis & TEMAlbanova E1:1015AD
DetailsSPM/AFM Multimode AlbanovaBruker (formerly Veeco) Multimode Nanoscope IVMetrologyAlbanova E1:1015AC
DetailsOpt. micr. 4, fluorescence, AlbanovaNikonME600 w. fluorescence unitSurface analysis & TEMAlbanova E1:1017AA
DetailsAJA Sputter AlbanovaAJA International Inc.OrionThin film depositionAlbanova E1:1017AD
DetailsSputnik AlbanovaThermionics + otherCustom madeThin film depositionAlbanova E1:1017AD
DetailsWire bonder AlbanovaKulicke - Soffa4523DDevice mountingAlbanova E1:1017AA
DetailsKarl Suss MJB3 AlbanovaKarl SussMJB3LithographyAlbanova C1:3049C
DetailsOpt. micr. 3, AlbanovaNikonEclipse L200Surface analysis & TEMAlbanova C1:3049A
DetailsAFM/SPM Nanow.JPK2 AlbanovaJPK InstrumentsNanowizard 3MetrologyAlbanova E1:1019AC
DetailsSPM/AFM FastScan AlbanovaBrukerDimension FastScanMetrologyAlbanova E1:1019AC
DetailsSPM/AFM Nanowizard JPK AlbanovaJPK InstrumentsNanowizard 3 Bioscience AFMMetrologyAlbanova E1:1019AC
DetailsSPM/AFM Icon AlbanovaBrukerDimension IconMetrologyAlbanova E1:1019AC
DetailsPLDNeocera IncNeocera Pioneer 180 UHV PLDThin film depositionY-Synth labsD
DetailsAlbanova Canon Projection CameraCanonPPC 210LithographyAlbanova C1:3049C
DetailsEurovac UHV deposit, AlbanovaEurovac/ThermionicsCustom madeThin film depositionAlbanova E1:1017AD
DetailsLPE 106LPEPE106EpitaxyC-Si-epiE