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Myfab

Realize your nano vision

All tools

Resources at your disposal

The Electrum Laboratory maintains a multitude of laboratories, covering most aspects of nano and microtechnology. In our flexible facilities both single samples and batches are equally welcome. We handle separate steps to full sequences in fabrication and characterization. We offer access to sophisticated software for calculation and simulation. Our personnel are available to help you to master the wide world of nano and microtechnology.

Full process lines and characterization resources

In our cleanroom we maintain full process lines for Silicon CMOS, MEMS and compound semiconductors, including GaAs, InP and SiC. We also offer access to a wide variety of techniques for characterization of materials and devices.

 NameManufacturerModelCategoryCurrent toolratetype name
DetailsRinser 2VerteqVerteqWet process benchesA
DetailsGammaSuss MicrotecGamma 4MLithographyC
DetailsBake 7MemmertUM 100 bakeLithographyA
DetailsFH APL-gulPM PlastDragskåpLithographyA
DetailsRoomRElabresponsibleOther processesA
DetailsTencorTencorSurface profiler Tencor-P10MetrologyB
DetailsGeminiZeiss Ultra 55Surface analysis & TEMC
DetailsALOESSTSICP AOE (DRIE)Dry etchingD
DetailsICPSTSICP DRIE (Si, SiO2)Dry etchingD
DetailsP5000Applied MaterialsPrecision 5000 Mark II (Dielectric, MxP, CVD)Dry etchingD
DetailsRTAMattson100 RTP SystemsThermal processesD
DetailsBonderKarl SussCB8 Substrate BonderDevice mountingC
DetailsKarl SussKarl SussMask aligner MA8/BA8LithographyC
DetailsSabinaSSESpinner model Primus SB15LithographyB
DetailsXLS-StepperGCA/Ultratech7500/2145 i-line stepperLithographyE
DetailsYes-ugnYESPolyimide Bake Oven YES-450PB8-2/6-2Thermal processesC
DetailsDisco-sawDiscoDFD640 SawingC
DetailsSTSSTSPECVDThin film depositionD
DetailsHR X-RayX-RayX-RayMetrologyB
DetailsnSPECNikonNiklasMetrologyB
DetailsPL mappingPhilipsCQL7840/DMetrologyB
DetailsRenrumElabAccessOther processesA
DetailsMårtenMårtenMårtenDevice mountingB
DetailsOrthodyneOrthodyne20 Large WirebonderDevice mountingB
DetailsRakelDage Precima InternationalRakelDevice mountingB
DetailsEsaOxford Plasma SystemPlasmalab80Plus (Oxford RIE System) Chamber BDry etchingD
DetailsFabioOxford InstrumentICP380 Etch SystemDry etchingD
DetailsGallusOxford InstrumentICP380 Etch System (GaAs & InP)Dry etchingE
DetailsTegalPlasmaline515 (RF Plasma Asher)Dry etchingB
DetailsTeplaTePla300 (Microwave Plasma Asher)Dry etchingB
DetailsDSW-StepperGCA/Ultratech8500/2035 g-line stepperLithographyE
DetailsEmmaKarl SussMA6/BA6LithographyC
DetailsNilsEVG620 UV Nanoimprint LithographyLithographyC
DetailsBarbaraProvacPAK 600 Coating SystemThin film depositionD
DetailsIndiraBalzersBA 510 Thermal EvaporatorThin film depositionD
DetailsZitaBalzersBAE 250 Coating SystemThin film depositionD
DetailsBlästerGuyson Europlast4 SF-Select (med inställbar hjöd) samt utsugningsfOther processesA
DetailsLäppusLogitech50 Precision Lapping & Polishing MachineOther processesB
DetailsPekkaPlasmalab80Plus (Oxford PECVD System) Chamber AThin film depositionD
DetailsPeoPEOPEO-603 Anneal furnace III/V (ramp)Thermal processesB
DetailsIBSCommonwealth Scientific CorporationIon Beam Sputtering ToolThin film depositionD
DetailsKDFKDF844GTThin film depositionD
DetailsFilippaSussMicrotecAutomatic Flip Chip Bonder FC150Device mountingD
DetailsM01 OlympusOlympusBX60MSurface analysis & TEMA
DetailsBalanceBalanceVågOther processesA
DetailsM11 Nikon/CD 1NikonOPTISHOT/LinjebreddsmätareMetrologyA
DetailsLEITZLEITZ MPV-SPThin film interferometry, MetrologyA
DetailsWetb-diff-cleanWet bench CleanWet bench Clean and IMECWet process benchesA
DetailsW0607Wet bench HF cleanWet bench HF clean and HF dopedWet process benchesA
DetailsWetb Si processWet bench oxideWet bench oxide,HF 1:10,BHF,HFmixWet process benchesA
DetailsWetb Si stripWet bench developerPhotoresist processing.Wet process benchesA
DetailsW1718Wet benchWet benchWet process benchesA
DetailsWetb MEMSWet benchTMAH, HF, KOHWet process benchesA
DetailsWetb metalWet benchAu/metal etchWet process benchesA
DetailsWetb solventWet benchRemover, Vax, Au moduleWet process benchesA
DetailsWetb Au developWet benchWet benchWet process benchesA
DetailsPamelaSTS 308PC (RF Plasma Asher)Dry etchingB
DetailsEpsilon2000ASM200Si-epiEpitaxyE
DetailsBake 2Bake oven DespatchPre and postprocessing of samplesLithographyA
DetailsBake 3Bake oven MemmertPre and postprocessing of samplesLithographyA
DetailsMasktvättUltra t Equipment Company, Inc.SCS 124LithographyA
DetailsQuicksealQuicksealInplastningOther processesA
DetailsSkivthkMitutoyoRDP transducer indicator E307-1MetrologyA
DetailsW2631Wet benchWet bench spray etch (GaAs).Wet process benchesA
DetailsW3233Wet benchWet bench lift off.Wet process benchesA
DetailsW34Wet benchWet bench LithografiWet process benchesA
DetailsAsterixAixtron AIX 200/4MovpeEpitaxyE
DetailsMozartVeeco TurboDiscGaAs-MOVPE D180 LDMEpitaxyE
DetailsObelixAixtronLP-VPE 2106EpitaxyE
DetailsSemlanEpigress VP508/SK SiC-VPEEpitaxyE
DetailsPlasmatvätt PicoDiener PICO RFLow pressure plasma etcherDry etchingB
DetailsArnoldSSE spincoaterOPTISPIN SST20LithographyB
DetailsFH APLFume hoodFume hoodWet process benchesA
DetailsWetb SiCWet bench Substrate cleaningWet process benchesA
DetailsWetb APL-gulWet benchWet benchWet process benchesA
DetailsRIEPlasmalab System 100RIE of thin films (Si3N4 & SiO2)Dry etchingD
DetailsAPL-HMDSYES-5E Vacuum Bake / Vapour Prime Processing SystemLithographyA
DetailsM02 Olympus/cameraOlympusBX60Surface analysis & TEMA
DetailsM03 LeicaLeicaMicroscopeSurface analysis & TEMA
DetailsRinser 1VerteqVerteqWet process benchesA
DetailsUVO CleanerJelight COmpany, Inc42-220Sample prepA
DetailsM04 LeitzLeitzLABORLUX 12 HLSurface analysis & TEMA
DetailsM05 Nikon/autoNikonMicroscopeSurface analysis & TEMA
DetailsHMDS 2IMTECStar 2000 (HMDS)LithographyA
DetailsR/D doubleSemitoolSemitool Double 870SWet process benchesA
DetailsFH Gul3PM PlastDragskåpLithographyA
DetailsKyl & frysElectroluxKylskåp/frysOther processesA
DetailsM07 Olympus/cameraOlympusMicroscopeSurface analysis & TEMA
DetailsR/D 3VerteqVerteqWet process benchesA
DetailsFH III/VPM PlastDragskåpWet process benchesA
DetailsR/D Gul1FSI PhoenixFSI Phoenix 4"Wet process benchesA
DetailsPrometeus autoKarl Suss and Temptronic TermoChuck SystemAutomatic Probestation PA 150 and TP03215B-3300-2MetrologyC
DetailsAFM AcreoDigital Instruments (Veeco)Atomic Force MicroscopeMetrologyC
DetailsDektakSTDektak3STMetrologyB
DetailsBertilWest Bond 7476E-79 Manual Wedge-Wedge Wire BonderDevice mountingB
DetailsM10 Nikon/autoNikonMicroscope (motorized objectives)Surface analysis & TEMA
DetailsFTP500FTPInterferometerMetrologyA
DetailsPrometeus manualKarl Suss and Temptronic TermoChuck SystemManual Probestation PM 5, TP0314AMetrologyB
DetailsRörtvättKTHhandmadeOther processesA
DetailsCenturaApplied MaterialsCentura II (DPS & MxP)Dry etchingD
DetailsProbestation 1 ManualCascade11000MetrologyA
DetailsProbestation 2 High VoltageCascade8-inch manualMetrologyA
DetailsALS-stepperGCA/UltratechALS 2035 G-lineLithographyE
DetailsBall bonderF&K Delvotec Semiconductor GmbH5410Device mountingB
DetailsAJA SputterAJA InternationalATC Orion-8Thin film depositionD
DetailsFE-TEMJEOLJEM 2100F(HR), JEOL Electron Microscope 2100 FieldSurface analysis & TEMD
DetailsFIB-SEMFEIQUANTA 3D FEG Surface analysis & TEMD
DetailsBake 4MemmertU 26LithographyA
DetailsBake 5MemmertU 26Thermal processesA
DetailsBake 6MemmertULM 400LithographyA
DetailsManual probstationSuss Microtech10500006 (probe station)MetrologyA
DetailsOptical profilometerVeecoWyko NT9300MetrologyB
DetailsAFM/SSRMVeeco/Digital InstrumentsNanoScope Dimension 3100MetrologyB
DetailsHallVarian/KeithlyIn-houseMetrologyB
DetailsAGMPrinceton Measurement Corporation2900-02 Alternating Gradient MagnetometerMetrologyC
DetailsR/D 2VerteqVerteq 4"Wet process benchesA
DetailsFH wet chemistry-1PM PlastDragskåp solvent (for service work)Wet process benchesA
DetailsR/D MetalsSemitoolSemitool 4" MetalsWet process benchesA
DetailsR/D GoldFSI PhoenixFSI Phoenix 4" Au/Lift-OffWet process benchesA
DetailsM13 Nikon/cameraNikonNikonSurface analysis & TEMA
DetailsCanon EOS 350DCanonEOS 350D 100mm MacroSurface analysis & TEMA
DetailsM08 Leitz/cameraLeitzMicroscope with cameraSurface analysis & TEMA
DetailsM09 Nikon/cameraNikonMicrosocpe with cameraSurface analysis & TEMA
DetailsMS01 NikonNikonStereo microscope SMZ-2BSurface analysis & TEMA
DetailsKemvåg??MetrologyA
DetailsMS02 NikonNikonStereo microscope SMZ-2TSurface analysis & TEMA
DetailsNapoleonAixtronVP508GFR SiC epiEpitaxyE
DetailsTesttoolTest ABStandardOther processesA
DetailsArielOxford Plasma TechnologyPlasmalab80Plus (Oxford RIE System)Dry etchingD
DetailsEdvardEdvards160Thin film depositionD
DetailsMaximusSSEMaximus 804LithographyC
DetailsFH wet chemistry-2PM PlastDragskåp solventWet process benchesA
DetailsFH wet chemistry-3PM PlastDragskåp solventWet process benchesA
DetailsFH wet chemistry-4PM PlastDragskåp solventWet process benchesA
DetailsFH wet chemistry-5PM PlastDragskåp solventWet process benchesA
DetailsFH wet chemistry-6PM PlastDragskåp solventWet process benchesA
DetailsManual spray coaterHome madev1LithographyA
Details4-PointFour Dimensions, IncModel 280MetrologyA
Details3D MF ProbestationIn-houseMedium Field MR and RF Probe StationMetrologyC
DetailsHF ProbestationIn-houseHigh Field RF Characterization StationMetrologyC
DetailsCIPTSmartipCIPTechMetrologyC
DetailsProbestation 3 Semi AutomaticCascade MicrotechCascade 12000MetrologyA
DetailsNetwork AnalyzerAgilentPNA 110 GHzMetrologyA
DetailsLab supportELABVirtual toolOther processesA
DetailsCritical Point DryerBaltecCPD 408Other processesB
DetailsSQUID-VSMQuantum DesignUtlrasensitiv magnetometerMetrologyC
DetailsPreparation labCollection of toolsTools for sample preparationSample prepB
DetailsLäcksökarenPfeiferQualyTest HLT260Other processesA
DetailsFiber annealÅngpaneföreningenSpecial designOther processesA
DetailsActivatorCentrothermActivator 150 (SiC anneal)Thermal processesD
DetailsALDBENEQTFS200Thin film depositionC
DetailsFH Gul1clanLAFVFR 1206 LAFLithographyA
DetailsMegasonic bathPCTPCT 24 wet benchWet process benchesA
DetailsAPL spinnerBLEBuilt inLithographyB
DetailsLIMSElabAccessOther processesA
DetailsDisco DAD sawDiscoDAD 320SawingB
DetailsUVISELHORIBAUVISEL ERMetrologyB
DetailsElectroglasElectroglas2001XMetrologyC
DetailsCD SEMHitachiS-3400N & EDS QUANTAX 200Surface analysis & TEMC
DetailsPlasma cleanerFischionePlasma cleanerSample prepA
DetailsGold sputter FNMJEOLIon sputter JFC-1100Sample prepA
DetailsDiamond sawBuehlerIsomet low speed sawSample prepA
DetailsGrinder-polisherBuehlerVector/AlphaSample prepA
DetailsUltrasonic disc cutterGatanModel 601Sample prepA
DetailsDimple grinderGatanDimple grinderSample prepA
DetailsElectrolyte polishingFischioneElectrolyte polishingSample prepA
DetailsIon polishingGatanPrecision ion polishing 691Sample prepA
DetailsM20 MicroscopeNanometricsMicroscopeSample prepA
DetailsLaboratory ovenHereausBench ovenSample prepA
DetailsEbeam litho AlbanovaRaith GmbHRaith 150 TKLithographyE
DetailsFIB/SEM AlbanovaFEI CompanyNova 200Surface analysis & TEMD
DetailsSPM/AFM Multimode AlbanovaBruker (formerly Veeco) Multimode Nanoscope IVMetrologyC
DetailsProfiler AlbanovaKLA-TencorP15MetrologyB
DetailsRIE ICP O2/AR AlbanovaOxfordPlasmalab 80+Dry etchingD
DetailsAJA Sputter AlbanovaAJA International Inc.OrionThin film depositionD
DetailsKarl Suss MJB3 AlbanovaKarl SussMJB3LithographyC
DetailsEdwards Auto 306 AlbanovaEdwardsAuto306 with FL400 chamberThin film depositionD
DetailsFH epi servicePM PlastDragskåp för epi rengöringWet process benchesA
DetailsWetb SabinaPM Plast2 HP, Developer, SinkWet process benchesA
DetailsFH wet chemistry-7PM PLastDragskåpWet process benchesA
DetailsFH wet chemistry-8PM PlastDragskåpWet process benchesA
DetailsM14 Olympus/cameraOlympusBX60Surface analysis & TEMA
DetailsT1-Oxide 1150CThermco5200Thermal processesB
DetailsT2-Oxide 1250CThermco5200Thermal processesB
DetailsT3-Gate oxThermco5200Thermal processesB
DetailsT4-FGAThermco5200Thermal processesB
DetailsEurovac UHV deposit, AlbanovaEurovac/ThermionicsCustom madeThin film depositionD
DetailsCryo RIE AlbanovaOxfordPlasmalab 100Dry etchingD
DetailsSputnik AlbanovaThermionics + otherCustom madeThin film depositionD
DetailsWire bonder AlbanovaKulicke - Soffa4523DDevice mountingA
DetailsBond Tester DAGEDAGE2400PCMetrologyA
DetailsTLE labTanner15.10Other processesA
DetailsPLDNeocera IncNeocera Pioneer 180 UHV PLDThin film depositionD
DetailsRIBEOxford Instruments Plasma TechnologyIonfab 300 plusDry etchingD
DetailsVT STMOmicronOmicron VT-STMSurface analysis & TEMA
DetailsSTM 1OmicronOmicron STM-1Surface analysis & TEMA
DetailsUHV SPM 3500RHK TechnologyUHV SPM 3500Surface analysis & TEMA
DetailsRaman Spectrometer HORIBA iHR 550HORIBA Jobin YvoniHR 550MetrologyA
DetailsBaltazar spectrometerSPECS GmbH and homemadeHomemadeMetrologyA
DetailsTesttool ELABElectrum labmodel 1MetrologyA
DetailsFs Laser system 1CoherentMira 900Other processesA
DetailsFs Laser system 2Coherent and APEChameleon Ultra II + APE Harmonics generatorOther processesA
DetailsScanning near-field optical microscope (SNOM)Max Born Institute with modifications at KTHA home-made instrument Surface analysis & TEMA
DetailsSPM/AFM Icon AlbanovaBrukerDimension IconMetrologyC
DetailsCryogenic ProbestationJanisST-500-UHTMetrologyC
DetailsFTIR SpectrometerBrukerVortex 70 VMetrologyC
DetailsEmpyreanPANalytical B.V.Empyrean multipurpose high resolution X-ray diffraMetrologyC
DetailsSPM/AFM FastScan AlbanovaBrukerDimension FastScanMetrologyC
DetailsSPM/AFM Nanowizard JPK AlbanovaJPK InstrumentsNanowizard 3 Bioscience AFMMetrologyC
DetailsProbestation 4 High Temp.SignatoneS-1060MetrologyA
DetailsEnduraApplied MaterialsPVDThin film depositionD
DetailsOpt. micr. 1, AlbanovaNikonME600Surface analysis & TEMA
DetailsOpt. micr. 2, AlbanovaNikonME600Surface analysis & TEMA
DetailsOpt. micr. 3, AlbanovaNikonEclipse L200Surface analysis & TEMA
DetailsOpt. micr. 4, fluorescence, AlbanovaNikonME600 w. fluorescence unitSurface analysis & TEMA
DetailsAFM/SPM Nanow.JPK2 AlbanovaJPK InstrumentsNanowizard 3MetrologyC