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Dice mounting

Dice are sawn or cleaved from the substrates after completed processing. Mounting and forming of electrical contacts are made by soldering, wire bonding or flip chip bonding. 

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(Extract from LIMS)
DetailsBonderKarl SussCB8 Substrate Bonder
DetailsDisco DAD sawDiscoDAD 320
DetailsWire bonder AlbanovaKulicke - Soffa4523D
DetailsFH MS OlympusLabrum klimatLAF
DetailsFH MS NikonLabrum klimatLAF
DetailsMicro Diamond Scriber, AlbanovaOEG GmbHMR-200
DetailsESEC Automatic WirebonderESEC3100 plus
DetailsParoteq Bonder AlbanovaParoteq GmbHH-system
DetailsCentrifuge Z 323HERMLEZ 323
DetailsHB16-TPT wire bonderTPTHB16
DetailsDisco cleanerDiscoDCS1441


2020-06-30 Quality group (P)